产品介绍Product introduction：

热压硅胶皮:

热压硅胶皮是一款具有高传热性、缓冲性和绝缘特点的通用性产品，具有优良的热传导性、缓冲性和极高的回弹能力，表面平整度高，主要针对各类液晶显示模组热压绑定生产制程中使用、以及各类电子产品摄像头.指纹锁热压绑定生产制程中使用。

Hot pressed silicone rubber is a general-purpose product with high heat transfer, cushioning and insulation characteristics. It has excellent thermal conductivity, cushioning, high resilience and high surface flatness. It is mainly used in the hot pressing binding production process of various liquid crystal display modules and cameras of various electronic products Fingerprint lock is used in the production process of hot pressing binding.

产品型号Product models：

JD-G20   JD-G25   JD-G30    JD-G45

产品用途：

1、适用于各类LCM显示屏（TP、TN、TFT、OLED）的热压邦定工艺（FOG、COG、TAB、热压导电膜、柔性电路板、ITO导电玻璃等），将其垫附在热压头的底部表面，对温度有传导缓冲作用，使温度均匀，隔离被热压产品与热压头直接接触，具有缓冲保护作用。

2、各种电器产品需要用到热传导及耐温及绝缘作用的应用场景。

Product purpose:

1. It is applicable to the hot pressing bonding process (fog, COG, tab, hot pressing conductive film, flexible circuit board, ITO conductive glass, etc.) of all kinds of LCM display screens (TP, TN, TFT, OLED). The pad is attached to the bottom surface of the hot pressing head, which has a conductive buffer effect on the temperature, makes the temperature uniform, isolates the hot pressed products from direct contact with the hot pressing head, and has a buffer protection effect.

2.Various electrical products need application scenarios of heat conduction, temperature resistance and insulation.

产品特点： 

1、极高的耐热性和缓冲性，不给FPC、IC、玻璃及产品等带来损伤。

2、具有超强高温热稳定特性和对产品的压力一致性，使ACF导电胶导电粒子破裂更均匀。

3、极高的回复力和非粘贴性，拉伸强度大。

4、表面无粉末，高温热压合不冒油。

Product features:

1. High heat resistance and cushioning, no damage to FPC, IC, glass and products.

2. It has super high temperature thermal stability and pressure consistency to the product, making the fracture of ACF conductive adhesive conductive particles more uniform.

3. Extremely high restoring force and non adhesion, high tensile strength.

4. There is no powder on the surface, and there is no oil after hot pressing at high temperature.

产品规格：

1、（厚T：0.2mm、0.25mm、0.3mm、0.45mm）*（宽W：5-1500mm）*（长L：5-50m）。

2、宽度及长度均可根据客户需求定做。 

热压硅胶皮性能参数表：

model型号/项目		JD-G20	JD-G25	JD-G30	JD-G45	检测方式/备注
thickness(mm)	厚度（mm）	0.2	0.25	0.3	0.45	厚度仪
colour	颜色	灰色	灰色	灰色	灰色	目测
Specific gravity      (g/mm3)	比重（g/mm3）	1.6	1.6	1.6	1.6	密度仪
Hardness (a)	硬度（A）	70-75	70-75	70-75	70-75	邵底硬度计
Temperature resistance (℃)	耐温（℃）	320	320	320	320	实际使用测得  （10秒以内）
Elongation at break (%)	断裂伸长率（%）	≥80	≥80	≥80	≥80	断裂伸长仪
Tensile strength      kg / C ㎡	抗拉强度     kg/c㎡	9	9.3	9.5	10	拉力计
Volume resistance    (Ω. Cm)	体积电阻（Ω.cm）	3*1014	3*1014	3*1014	3*1014	表面电阻仪
Thermal conductivity (M/MK)	导热系数     W/(㎡*k)	0.4	0.4	0.4	0.4	导热测试仪
Compression set  (max%)	压缩变形（Max%）	≤15	≤15	≤15	≤15	压缩变形器
Recommended pressing times	推荐压合次数	10	10	10	10	测试条件：接触面平整，280℃，30KG/㎝2
Dielectric constant  (F/M)	介电常数    (F/M)	2.1	2.1	2.6	3.1	(100～1MHz) 介电常数测试仪
Dielectric dissipation (S)	介电消散      (S)	0.002	0.002	0.002	0.002	(23℃,1MHz)   介电常数测试仪
Thermogravimetric analysis  (%)	热重分析（%）	≤5	≤5	≤5	≤5	200℃/72H
Si content (%)	Si硅含量（%）	≥80	≥80	≥80	≥80	包含SiO2
material structure	材料结构	Si,SiO2	Si,SiO2	Si,SiO2	Si,SiO2	主要成份
注意：以上有些数据以实验测得，产品使用过程中会因各种条件(比如:温度,压力,表面粗糙度,接触面积)不同而有所差异           Note: some of the above data are measured experimentally. During the use of the product, there will be differences due to various conditions (such as temperature, pressure, surface roughness and contact area)